| 摘要 |
A method for manufacturing a patterned medium employing an imprinting method is provided, which can prevent the occurrence of resist pattern faults due to gas trapped between the imprinting mold surface and the resist layer, as well as resist pattern faults due to bubbles which can be formed in the resist film and at the resist surface. As preprocessing for an imprinting process, exposure processing is performed in which a substrate with a resist film formed on the surface thereof is exposed to an atmosphere at a temperature higher than the temperature at the time of imprinting and an environmental pressure lower than the environmental pressure at the time of imprinting.
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