AN OPTICAL SUBSTRATE AND SENSING CHIP

摘要

There is provided a method for the manufacture of an optical substrate for optical sensing applications comprising curing a curable polymer in a mould providing that the substrate is wholly or partly formed from the cured polymer and that the cured polymer is shaped so as to be capable of directing light to an internal surface of the substrate, or of a layer provided thereto, at an angle equal to or greater than the critical angle for total internal reflection thereat. Also provided are optical sensing chips including the optical substrate.