| 摘要 |
PURPOSE: A sub-mount for packaging a subminiature high-power micro chip is provided to increase the robustness of a product by realizing an integrated assembly and improve the practicality without maintenance and repair. CONSTITUTION: A section-excited micro chip laser radiates a beam to a laser active medium by using a laser diode(10) as an excitation light source to oscillate the laser in an incident direction. The micro chip laser is made of a metallic conductor having excellent thermal conductivity. The metallic conductor is one or more materials selected from brass, silver, copper, aluminum alloy, titanium and group consisting of the titanium alloy. The micro chip laser facilitates the thermal control by placing a TEC in an integrated base(20). |
