INSULATING SHEET AND MANUFACTURING METHOD THEREOF AND PRINTED CIRCUIT BOARD WITH INSULATING SHEET AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: An insulation sheet, a manufacturing method thereof, a printed circuit board using the same, and a method for manufacturing the printed circuit board are provided to prevent the warpage or twist of the printed circuit board by making an insulation substrate similar to the thermal expansion coefficient of a semiconductor chip. CONSTITUTION: A reinforcing substrate(10) stacking a thermoplastic resin layer is provided. A thermoplastic resin layer(20) stacked on the reinforcing substrate is stacked on a core substrate(32). The reinforcing substrate and the thermoplastic resin layer are thermally pressed on the core substrate. The thermal expansion coefficient of the transverse direction of the core substrate is between -20 and 9 ppm/°C.