发明名称 BEAM PROCESSING APPARATUS, BEAM PROCESSING METHOD, AND BEAM PROCESSING SUBSTRATE
摘要 <p>Disclosed is a beam processing apparatus that processes a layer to be processed (3) formed on one surface of a substrate (2), by irradiating the same with a beam. The beam processing apparatus comprises: a gas floating mechanism (10) that emits gas to support the substrate so as to float in a flat position; and a beam irradiating means (50) that processes the layer to be processed (3), formed on one surface of the substrate (2), by irradiating the same with a beam. The substrate (2) is arranged above the gas floating mechanism (10) so that the layer to be processed (3) formed on one surface of the substrate (2) is facing downwards. Processing is carried out on the layer to be processed (3) by emitting a beam through the substrate (2) and onto the layer to be processed (3) using the beam irradiating means (50) from above the other side of the substrate (2).</p>
申请公布号 WO2009119457(A1) 申请公布日期 2009.10.01
申请号 WO2009JP55499 申请日期 2009.03.19
申请人 MARUBUN CORPORATION;NAKADA, SATOKI;YAMAOKA, HIROSHI;KINOMOTO, RYO 发明人 NAKADA, SATOKI;YAMAOKA, HIROSHI;KINOMOTO, RYO
分类号 B23K26/10;B23K26/00;B23K26/14;B23K26/42;H05K3/00;H05K3/08 主分类号 B23K26/10
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