| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component which is capable of mitigating the stress concentration of the bonding part of a solder bump, capable of being manufactured without a precise lifting apparatus and applicable to a general substrate, and to provide a method for manufacturing the same. <P>SOLUTION: The electronic component 10 includes an LSI chip 12 having a plurality of electrode pads 11, a resin substrate 14 having a plurality of electrode pads 13, and a plurality of solder bumps 15 for causing the plurality of electrode pads 11 and the plurality of electrode pads 13 to face each other and connecting them. The pitch of the electrode pads 11 and the pitch of the electrode pads 13 are the same. The electrode pads 11 and the electrode pads 13 facing each other through the solder bump 15 are shifted in parallel with each other. <P>COPYRIGHT: (C)2010,JPO&INPIT |
