发明名称 LED DEVICE AND METHOD OF MANUFACTURING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To solve the following problem: although a surface-mounted LED device is frequently used which has silver plating with high reflectivity on a wiring conductor portion surface irradiated with LED emitted light so as to have conductivity and reflection characteristics on a surface where an LED is mounted, the surface-mounted LED device does not have satisfactory stabilities of luminance and chromaticity due to discoloration of silver and does not have satisfactory longer life while a white LED device for lighting using an LED chip having a short wavelength and high luminance is desirable. <P>SOLUTION: A step of manufacturing an ordinary LED device includes a step of applying a SiO<SB>2</SB>coating liquid onto a base material and carrying out a heat treatment after an LED chip is mounted on the base material and wired. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009224536(A) 申请公布日期 2009.10.01
申请号 JP20080067149 申请日期 2008.03.17
申请人 CITIZEN HOLDINGS CO LTD 发明人 FUKUSHIMA MIZUE
分类号 H01L33/32;H01L33/44;H01L33/48;H01L33/56;H01L33/60 主分类号 H01L33/32
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