METHOD FOR WET CHEMICAL ETCHING

摘要

In order to carry out a wet chemical etching for removing a protection (9) made of a magnetic material on the surface of an integrated electronic component (5), the invention comprises dipping the component (1) in an etching solution (2) and accelerating (4, 11) the chemical etching. In order to improve the etching and control the etching time, the electronic component in the solution is moved (13) by subjecting the same to the action of a rotating magnetic field (11). The rotation stops by itself as soon as the protection is dissolved.