| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a surface acoustic wave (SAW) device including a chip fixing structure capable of effectively using an ultraviolet curing resin as a joining agent, even for a SAW element piece of which ultraviolet transmissivity gets worse. Ž<P>SOLUTION: In the SAW device 10, on the mounting surface of a package 20, a SAW element piece 12 adopting as a piezoelectric blank 14 lithium niobate or lithium tantalate to which oxidization reduction treatment has been applied for reducing volume resistivity, is fixed. The side surface of the SAW element piece 12 and the mounting surface are bonded together by an ultraviolet curing resin 34 applied around the SAW element piece 12. In the SAW device 10 of such the structure, it is desirable to apply the ultraviolet curing resin 34 around the entire circumference of the SAW element piece 12. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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