| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can prevent an organic semiconductor layer from peeling at the interface of a protective film while sufficiently protecting the organic semiconductor layer with the protective film, and therefore has excellent characteristics and enhanced yield by virtue of improved mechanical reliability. SOLUTION: A semiconductor device 1a includes an organic semiconductor layer 13 that is pattern-formed on a substrate 3, and a protective film 15 that is pattern-formed on the substrate 3 so as to cover an exposed surface including a sidewall of the organic semiconductor layer 13. An insulating partition 11 having an opening 11a is provided on the substrate 3, and the organic semiconductor layer 13 is pattern-formed at a lower portion of the opening 11a of the partition 11 so that the organic semiconductor layer 13 is isolated by the partition 11. The protective film 15 is provided so as to fill the opening 11a of the partition 11. COPYRIGHT: (C)2010,JPO&INPIT
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