发明名称 THERMOVALVE AND HEAT TRANSFER MEDIUM CIRCUIT WITH THE THERMOVALVE
摘要 PROBLEM TO BE SOLVED: To provide a thermovalve which can control the flow of a heat medium optimally while attaining a low pressure loss by a simple, low-cost, lightweight and compact constitution, and a heat medium circuit equipped with the thermovalve. SOLUTION: The thermovalves (1, 100, 200, 300) are arranged in the heat medium circuit in which the heat medium flows, and equipped with valves operated in the direction along the flow of the heat medium and thermosensing movable part s(2) to activate the opening and closing of the valve in the direction along with the flow of the heat medium using the thermally-actuated operation according to the temperature of the heat medium. In the circuit which controls the flow of the heat medium according to the temperature of the heat medium, the valves are composed of coil spring valves (3, 103, 203, 230, 303) in which passage cross-section areas of channels of the heat medium are increased or decreased by a gap change of a winding part interlocking with thermally-actuated operations of the thermosensing movable parts (2) for opening and closing operation. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009222217(A) 申请公布日期 2009.10.01
申请号 JP20080070743 申请日期 2008.03.19
申请人 FUJI SEIKO KK;COREA ELECTRONICS CORP 发明人 PARK HEE WAN;SUZUKI TAKATOMO;TAKAHASHI MASARU
分类号 F16K31/68;F01P7/16;F16K13/00 主分类号 F16K31/68
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