发明名称 POLYAMIC ACID SOLUTION COMPOSITION, AND POLYIMIDE FILM
摘要 PROBLEM TO BE SOLVED: To provide a polyamic acid solution composition which is excellent in storage stability even at a high concentration and a low viscosity, and can give a polyimide film having excellent mechanical characteristics without cracking the film by a method for coating the solution composition on a substrate to form a filmy product and then thermally treating the filmy product. SOLUTION: Provided is the method for producing the polyamic acid solution, comprising reacting 3,3', 4,4'-biphenyltetracarboxylic dianhydride (tetracarboxylic acid component) with 20 to 95 mol% of diaminodiphenyl ether and 80 to 5 mol% of 2,4-toluenediamine (diamine component) in a solvent, characterized by reacting the diamine component with an excessive molar amount of the tetracarboxylic acid component in a solution containing water in an amount exceeding 1/3 molar time of the tetracarboxylic acid component, adding the diamine component or the diamine component and the tetracarboxylic acid component to the polyamic acid solution so that the molar amount of the diamine component is substantially equal to the molar amount of the tetracarboxylic acid component, and further reacting the components. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009221398(A) 申请公布日期 2009.10.01
申请号 JP20080069189 申请日期 2008.03.18
申请人 UBE IND LTD 发明人 NAKAYAMA TAKENARI;TAKABAYASHI SEIICHIRO;TAKASAKI NORI
分类号 C08G73/10 主分类号 C08G73/10
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