发明名称 |
METHOD FOR DICING WAFER AND PROCESS FOR MANUFACTURING LIQUID-DISCHARGING HEAD USING THE DICING METHOD |
摘要 |
A method for dicing a wafer having a first face in which opening are arranged along dicing streets. The method includes a step of affixing a dicing tape to the first face such that the dicing tape lies over the openings and adhesive regions of the dicing tape are exposed in the openings and a step of treating the dicing tape to reduce the adhesive strength of the adhesive regions.
|
申请公布号 |
US2009242111(A1) |
申请公布日期 |
2009.10.01 |
申请号 |
US20090469405 |
申请日期 |
2009.05.20 |
申请人 |
CANON KABUSHIKI KAISHA |
发明人 |
IRI JUNICHIRO;KASHINO TOSHIO;INADA GENJI |
分类号 |
B32B37/02;B41J2/16;H01L21/00 |
主分类号 |
B32B37/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|