SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
摘要
<p>Disclosed is a semiconductor device comprising a connection electrode (7) formed on a semiconductor element substrate (5) of a semiconductor element at a position facing a bump (3), a surface protection layer (8) which is formed around the connection electrode (7) and on the semiconductor element substrate (5), and a barrier metal layer (10) which is formed on the connection electrode (7) and the surface protection layer (8) and electrically connected to the bump (3). A portion of the surface protection layer (8) to be connected with the barrier metal layer (10) is provided with a recess.</p>
