| 摘要 |
PURPOSE: A probe assembly of probe card and manufacturing method thereof are provided to prevent probe pins and wafer from being physically damaged. CONSTITUTION: The probe assembly of probe card includes the probe substrate(20), the support layer(30), the conductive adhesive(40), and the probe pin(10). The probe substrate is electrically connected to the circuit wiring(22). The probe substrate includes the pad(24) arranged to the surface with the micro gap. The support layer is contacted with the surface of the probe substrate. The support layer includes the nozzle hole(32) formed in the location corresponding to a pad. The conductive adhesive is formed in the nozzle hole. The probe pin includes the connecting post(12), the horizontal beam(14), and the contact tip(16). The connecting post is electrically connected to a pad and is physically fixed by the conductive adhesive. The connecting post is inserted in vertical direction in the conductive adhesive. The horizontal beam is separated from the surface of the probe substrate. The support layer is made of the same semiconductor material as a wafer.
|
