| 摘要 |
<p>PURPOSE: A method for preventing a pad contamination is provided to prevent a pad contamination by using the pad protective layer and the deterioration of the semiconductor pad. CONSTITUTION: The metal layer(20) is formed on the semiconductor substrate(10). The passivation layer(30) is formed on the metal layer. The passivation layer is etched to expose a part of the metal layer. The pad protective layer(60) is formed at the upper part of the exposed metal layer and the passivation layer which is not etched.</p> |
