发明名称 RESIN SHEET FOR ENCAPSULATING OPTICAL SEMICONDUCTOR ELEMENT AND OPTICAL SEMICONDUCTOR DEVICE
摘要 PURPOSE: A resin sheet for encapsulating optical semiconductor element and optical semiconductor device are provided to simplify the step for encapsulating the opto-semiconductor device and the step for mounting the metal layer on the substrate. CONSTITUTION: The resin sheet(1) for encapsulating the opto-semiconductor device includes the capsule resin layer(3), the adhesive resin layer(4), and the metal layer(5) and protection resin layer(2). The capsule resin layer is arranged adjacent to the metal layer. The protection resin layer is laminated on the capsule resin layer and metal layer to covers the capsule resin layer and metal layer. The capsule resin layer has the tapered shape expanded to the protection resin layer.
申请公布号 KR20090102662(A) 申请公布日期 2009.09.30
申请号 KR20090024697 申请日期 2009.03.24
申请人 NITTO DENKO CORPORATION 发明人 SUEHIRO ICHIRO;AKAZAWA KOUJI;USUI HIDEYUKI
分类号 H01L23/29;H01L23/31;H01L33/48;H01L33/56;H01L33/60;H01L33/62 主分类号 H01L23/29
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