THERMOSETTING RESIN COMPOSITION AND SEMICONDUCTOR DEVICE OBTAINED WITH THE SAME

摘要

A THERMOSETTING RESIN COMPOSITION (7) WHICH CONTAINS: (A) AN EPOXY RESIN HAVING AT LEAST TWO EPOXY GROUPS PER MOLECULE; (B) A HARDENER; (C) A COMPOUND REPRESENTED BY THE FOLLOWING GENERAL FORMULA (1) OR (2); AND (D) A MICROCAPSULE TYPE HARDENING ACCELERATOR CONTAINING MICROCAPSULES EACH HAVING A STRUCTURE MADE UP OF A CORE CONTAINING A HARDENING ACCELERATOR AND A SHELL COVERING THE CORE AND CONTAINING A POLYMER HAVING A STRUCTURAL UNIT REPRESENTED BY THE FOLLOWING GENERAL FORMULA (3), AND WHICH, WHEN EXAMINED BY DIFFERENTIAL SCANNING CALORIMETRY AT A HEATING RATE OF 10°C./MIN, SHOWS AN EXOTHERMIC PEAK DUE TO REACTION IN THE RANGE OF FROM 180 TO 250°C., AND A SEMICONDUCTOR DEVICE OBTAINED THROUGH SEALING WITH THE COMPOSITION ARE DESCRIBED.