| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem for a semiconductor device, wherein two semiconductor chips are laminated and sealed by one resin-sealing body, that debris or the like occurred during welding leads of the semiconductor chips causes the yield of the semiconductor device to decrease. SOLUTION: In the manufacturing method of a semiconductor device having a resin-sealing body, first and second semiconductor chips with electrode on the front surface of their front and rear surfaces, a first lead extending through the inside and outside of the resin-sealing body and electrically connected to the electrode of the first semiconductor chip, and a second lead extending through the inside and outside of the resin-sealing body and electrically connected to the electrode of the second semiconductor chip, after forming the resin-sealing body with superposing the respective first and second leads, the first and second leads are respectively jointed by welding. The welding is performed, by making the laser light irradiated from the upper side of any one of the first and second leads. COPYRIGHT: (C)2006,JPO&NCIPI |
