NON CONTACT POLISHING EQUIPMENT AND POLISHING METHOD OF THE SAME

摘要

PURPOSE: A method and a device for processing a substrate with a noncontact method are provided to planarize the substrate through heating and cooling process using the high temperature. CONSTITUTION: A loading unit loads a substrate(10). A heating unit heats the substrate transferred from the loading unit with an organic transition temperature. A cooling unit cools the heated substrate to the glass crystallization temperature. An unloading unit unloads the substrate.