| 摘要 |
PURPOSE: A flexible copper-clad laminate is provided to be used for high integration and high density in electronic equipment. CONSTITUTION: A flexible copper-clad laminate represents a polyimide rein whose one side or both sides are laminated with copper film. The surface of the copper film, contacted with the polyimide resin layer, has a surface treatment layer consisting of a plurality of treatment layers containing silane coupling treating layer. The surface treatment layer contains copper, cobalt, nickel, and zinc. A ratio of nickel/(nickel+cobalt+zinc) is 0.23 or greater measured by ICP-AES. The content of zinc is within 0.2~0.6mg/dm^2. The silane coupling treating layer is formed by a silane coupling agent having amino groups.
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