STRUCTURE AND MANUFACTURE METHOD FOR MULTI-ROW LEAD FRAME

摘要

PURPOSE: A multi-row lead frame and a method for manufacturing the same are provided to improve productivity by not removing the used carrier material completely after assembling the chip. CONSTITUTION: A patterning part(14) with a pattern surface is formed in one surface of a lead frame material. The pattern surface of the patterning part forms a coating layer. A protective layer is formed on a rear surface of the pattern surface. A both-sided patterning part(33) is formed by pattering the pattern surface and the rear surface of the patterning part. A plating layer(41) is formed by plating the both-sided patterning part. The lead frame is completed by removing the protective layer.