发明名称 FLEXIBLE PRINTED CIRCUIT BOARD BONDING DEVICE
摘要 PURPOSE: A flexible printed circuit board bonding device is provided to set a temporary bonding location of a flexible printed circuit board by using a vision device, thereby removing a need that a worker directly changes a location of the flexible printed circuit board. CONSTITUTION: A flexible printed circuit board bonding device(100) includes an ACF bonding unit(101), a temporary bonding unit(102) and a main bonding unit(103). The ACF bonding unit bonds an ACF(Anisotropic Conductive Film) to an element. The temporary bonding unit temporarily bonds a flexible printed circuit board to the element. The main bonding unit pressurizes the flexible printed circuit board to bond and fix. The temporary bonding unit includes a vision device. The vision device detects a bonding circuit pattern of an element and a location of a bonding end circuit pattern of the flexible printed circuit board. The bonding end circuit pattern of the flexible printed circuit board is arranged in a bonding circuit pattern according to a detection result of the vision device. The flexible printed circuit board is temporarily bonded to the element by contacting the flexible printed circuit board with the element.
申请公布号 KR20090102096(A) 申请公布日期 2009.09.30
申请号 KR20080027337 申请日期 2008.03.25
申请人 SEHF-KOREA CO., LTD. 发明人 YANG, JAI SEOK
分类号 H05K13/04;H05K3/30 主分类号 H05K13/04
代理机构 代理人
主权项
地址