发明名称 |
COPPER ALLOY PLATE FOR ELECTRICAL AND ELECTRONIC COMPONENTS |
摘要 |
A Cu-Fe-P alloy sheet that is provided with the high strength and with the improved resistance of peel off of oxidation film, in order to deal with problems such as package cracks and peeling, is provided. A copper alloy sheet for electric and electronic parts according to the present invention is a copper alloy sheet containing Fe: 0.01 to 0.50 mass% and P: 0.01 to 0.15 mass%, respectively, with the remainder of Cu and inevitable impurities. A centerline average roughness Ra is 0.2 µm or less and a maximum height Rmax is 1.5 µm or less, and Kurtosis (degree peakedness) Rku of roughness curve is 5. 0 or less, in measurement of the surface roughness of the copper alloy sheet in accordance with JIS B0601. |
申请公布号 |
EP2088214(A4) |
申请公布日期 |
2009.09.30 |
申请号 |
EP20070807885 |
申请日期 |
2007.09.26 |
申请人 |
KABUSHIKI KAISHA KOBE SEIKO SHO |
发明人 |
ARUGA, YASUHIRO;OZAKI, RYOICHI;MIWA, YOSUKE |
分类号 |
C22C9/00;C22C9/02;C22C9/04;C22C9/06;C22F1/00;C22F1/08;H01L23/48 |
主分类号 |
C22C9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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