| 摘要 |
PURPOSE: A heat sink for a wireless communication device and a manufacturing method thereof are provided to compress, mold and combine a base with a cooling fin even though the cooling fin of the heat sink is long, thereby simplifying the manufacturing process. CONSTITUTION: A heat sink(100) for a wireless communication device includes a base(110) and a cooling fin(120). The interval between cooling fins is 13mm. A method of manufacturing the heat sink of the wireless communication device comprises the following steps. The heat sink is configured by a base and the cooling fin and is compression-molded. Compression-molding is successively performed using four molds. 40% of the maximum pressure is applied to the first mold. 80% of the maximum pressure is applied to the second mold. 100% of the maximum pressure is applied to the third mold.
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