发明名称 PLASMA ETCHING APPARATUS AND PLASMA ETCHING METHOD THEREOF
摘要 PURPOSE: A plasma etching device and a plasma etching method are provided to improve brightness of a light emitting device or a flat display by forming a lens shaped pattern on a substrate. CONSTITUTION: A plasma etching apparatus includes a reactive chamber, an antenna, and a chuck. The reactive chamber provides the space in which the plasma is generated. An antenna is prepared in the upper part of the reactive chamber and a source power is applied to the antenna. The chuck is prepared in the reactive chamber and the bias power is applied to the chuck. A plasma etching process is performed by applying a first source power and a first bias power to the antenna and the chuck respectively(S121). The plasma etching process is performed by applying a second source power and a second bias power to the antenna and the chuck(S122). The plasma etching process is performed by applying a third source power and a third bias power to the antenna and the chuck(S123).
申请公布号 KR20090102255(A) 申请公布日期 2009.09.30
申请号 KR20080027582 申请日期 2008.03.25
申请人 TAINICS CO., LTD.;KIM, NAM JIN;PARK, JONG HO 发明人 KIM, JEONG TAE;CHO, HO YONG;KIM, HA JONG;KIM, GWANG TAE;PARK, JONG HO;KIM, NAM JIN
分类号 H01L21/3065 主分类号 H01L21/3065
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