发明名称 Expanding thermal plasma deposition system
摘要 A system to coat a substrate includes a deposition chamber maintained at sub-atmospheric pressure, one or more arrays containing two or more expanding thermal plasma sources associated with the deposition chamber, and at least one injector containing orifices for each array. The substrate is positioned in the deposition chamber and each expanding thermal plasma source produces a plasma jet with a central axis, while the injector injects vaporized reagents into the plasma to form a coating that is deposited on the substrate. The injector orifices are located within a specified distance from the expanding thermal plasma source to obtain generally a coating with generally uniform coating properties.
申请公布号 US7595097(B2) 申请公布日期 2009.09.29
申请号 US20050075343 申请日期 2005.03.08
申请人 EXATEC, L.L.C. 发明人 IACOVANGELO CHARLES D.;MIEBACH THOMAS;MERCEDES MICHAEL W.;GASWORTH STEVEN M.;HAAG MICHAEL R.
分类号 H05H1/24;B05D7/24;C23C16/00;C23C16/513 主分类号 H05H1/24
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