发明名称 Anodic bonding apparatus, anodic bonding method, and method of producing acceleration sensor
摘要 An anodic bonding apparatus includes a first electrode and a second electrode. The first electrode has a first surface, and the second electrode has a second surface facing the first surface. The first surface includes a first central area; a first substrate placing area for placing a laminated substrate; and a first peripheral area surrounding the first substrate placing area. The second surface includes a second central area corresponding to the first central area; a second substrate placing area surrounding the second central area; and a second peripheral area corresponding to the first peripheral area and surrounding the second substrate placing area. Further, the second electrode includes a curved portion curved toward the first electrode, so that a distance between the first central area and the second central area becomes smaller than a distance between the first peripheral area and the second peripheral area.
申请公布号 US7595545(B2) 申请公布日期 2009.09.29
申请号 US20060375053 申请日期 2006.03.15
申请人 OKI SEMICONDUCTOR CO., LTD. 发明人 SUEYOSHI SHINICHI
分类号 H01L23/58 主分类号 H01L23/58
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