发明名称 |
Anodic bonding apparatus, anodic bonding method, and method of producing acceleration sensor |
摘要 |
An anodic bonding apparatus includes a first electrode and a second electrode. The first electrode has a first surface, and the second electrode has a second surface facing the first surface. The first surface includes a first central area; a first substrate placing area for placing a laminated substrate; and a first peripheral area surrounding the first substrate placing area. The second surface includes a second central area corresponding to the first central area; a second substrate placing area surrounding the second central area; and a second peripheral area corresponding to the first peripheral area and surrounding the second substrate placing area. Further, the second electrode includes a curved portion curved toward the first electrode, so that a distance between the first central area and the second central area becomes smaller than a distance between the first peripheral area and the second peripheral area.
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申请公布号 |
US7595545(B2) |
申请公布日期 |
2009.09.29 |
申请号 |
US20060375053 |
申请日期 |
2006.03.15 |
申请人 |
OKI SEMICONDUCTOR CO., LTD. |
发明人 |
SUEYOSHI SHINICHI |
分类号 |
H01L23/58 |
主分类号 |
H01L23/58 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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