| 摘要 |
PURPOSE: A device and a method for manufacturing a semiconductor are provided to promote the stability of a device characteristic and to improve a yield of the semiconductor device through a device forming process and a device separating process. CONSTITUTION: A device for manufacturing a semiconductor includes a reaction chamber(11), a rotator(12), a rotation driving device(17), a gas supply unit, a gas discharge unit, a rectifying plate, an annular rectifying pin, and a distance control unit. The wafer is inputted to the reaction chamber and is deposited. The rotator includes a holder for holding the inputted wafer. A heater heating the wafer is installed in the rotator. The rotation driving unit is connected to the rotator. The rotation driving unit rotates the wafer. The gas supply unit supplies a small amount of the process gas to the reaction chamber. The gas discharging unit discharges the gas. The gas discharging unit controls the inside of the reaction chamber with the pressure. The rectifying plate rectifies the process gas and supplies the rectified gas to the wafer of the holder. An inner diameter of the upper part is larger than the inner diameter of a lower part. The rectifying pin rectifies the gas discharged from the wafer to the direction of the outer circumference downward. The distance control unit controls a vertical distance of the rectifying plate and the wafer and the vertical distance of the rectifying pin and the upper part of the rotator to the predetermined distance.
|
