IMPROVED ADHESION TO COPPER AND COPPER ELECTROMIGRATION RESISTANCE

摘要

PURPOSE: A method for improving an adhesive force with copper and a copper electromigration resistance is provided to reduce the electromigration without increasing a conductive resistance. CONSTITUTION: A substrate with one or more patterned dielectric layers and conductive metal layers is provided to a process chamber. An organic metal precursor is introduced to the process chamber. An adhesive layer is selective deposited on at least one or more patterned conductive metal layer.