发明名称 COB-TYPE CHIP PACKAGE BUILT-IN LED FOR A MEMORY CARD, AND MANUFACTURING METHOD THEREOF
摘要 A COB-type chip package built-in led for a memory card, and a manufacturing method thereof are provided to easily verify the operation state of the memory card. A COB type chip package comprises a printed circuit board(100), a circuit device, and an EMC film(300). The circuit device is arranged on the printed circuit board. The circuit devices comprise the non-volatile memory device(210) and an emitting device(290). The light emitting surface of the emitting device is exposed by the outside of the COB type chip package through the one side of the EMC film.
申请公布号 KR100919218(B1) 申请公布日期 2009.09.28
申请号 KR20070087844 申请日期 2007.08.30
申请人 发明人
分类号 H01L23/50;H01L23/12;H01L33/00 主分类号 H01L23/50
代理机构 代理人
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