| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package capable of achieving complete void-free junction. SOLUTION: In the semiconductor package, a semiconductor substrate 1 is joined with a junction material 6 through an adhesive resin layer 2. The adhesive resin layer 2 has a space 5 into which gas is to be driven at least on one portion on a scribe line 3. In the space 5 into which gas is to be driven, it is preferable to leave adhesive resin at least on either one of the semiconductor substrate 1 side and the junction material 6 side. COPYRIGHT: (C)2009,JPO&INPIT
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