| 摘要 |
PROBLEM TO BE SOLVED: To provide an inexpensive high frequency module which has good reliability and productivity, and also a method of manufacturing the high frequency module. SOLUTION: A high frequency module 1 comprises a printed circuit board 11 having circuit components 12 mounted thereon, a covering resin 14 for covering the circuit components 12, and a metallic casing 13 located on the printed circuit board 11 to cover the circuit components 12. The metallic casing 13 has a resin injection hole 13b as an injection port through which the covering resin 14 is injected into the casing to cover the circuit components 12. The resin injection hole 13b is located at a position in a surface 13f which is opposed to the printed circuit board 11 and corresponds to the circuit components 12. The metallic casing 13 has viewing holes 13c which are formed in the surface 13f opposed to the printed circuit board 11 to observe the condition of the covering resin 14, and also has observing notches 13d formed in its sides 13s abutting against the printed circuit board 11 to observe the condition of the covering resin 14. COPYRIGHT: (C)2009,JPO&INPIT
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