| 摘要 |
A printed circuit board assembly includes: a substrate; an soldermask formed on the substrate and formed with a recess; a solder pad having a first end portion received in the recess and formed on the portion of the substrate, and a second end portion extending from the first end portion; and a solder paste having a first end portion formed on the first end portion of the solder pad, and a second end portion extending from the first end portion of the solder paste and formed on a portion of the soldermask, which is formed on the second end portion of the solder pad.
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