| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrostatic chuck capable of preventing the occurrence of arcing accompanying an increase in plasma density. SOLUTION: The electrostatic chuck 10 is used for a semiconductor manufacturing apparatus comprising a cooling device 1 and an electrostatic chuck body 2 arranged on the cooling device 1 and having a work mounting surface. In the electrostatic chuck, (1) a gas supply hole 1a penetrates through the cooling device 1 and extends from one main surface of the cooling device to the other main surface, and a main counterbore portion 1b is provided in an opening of the gas supply hole 1a and has the diameter greater than that of the gas supply hole 1a, (2) an arcing preventing member 3 made of an insulating member having a gas flow channel 3a that communicates with the gas supply hole in its center is embedded in the main counterbore portion 1b, and (3) the work mounting surface is provided with a fine hole 2a1 that communicates with the gas supply hole 1a via the gas flow channel 3a. COPYRIGHT: (C)2009,JPO&INPIT |
