发明名称 |
METHOD FOR STORING ELECTRONIC MEMBER |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for storing electronic members which does not requiring a baking process having been performed to prevent delamination at a high temperature reflow after introduction of a lead-free soldering, by storing electronic members with a package having no oxygen and no moisture from just after manufacturing until just before mounting. <P>SOLUTION: In the method for storing electronic members, the electronic members is stored in a gas barrier container together with an oxygen absorbent which does not need water for developing oxygen absorbing function and a dehumidification agent. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
申请公布号 |
JP2009214922(A) |
申请公布日期 |
2009.09.24 |
申请号 |
JP20080062616 |
申请日期 |
2008.03.12 |
申请人 |
MITSUBISHI GAS CHEM CO INC |
发明人 |
SAKAMOTO MASARU;MASUDA AKIHIRO |
分类号 |
B65D85/86;B01D53/14;B01J20/22;B01J20/26;B65D81/24;B65D81/26;H05K3/34 |
主分类号 |
B65D85/86 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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