发明名称 RESIN SEALING APPARATUS AND RESIN SEALING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a resin sealing apparatus which separates resin molded items from unnecessary resin when opening a mold, and makes an operation in post-processing process easy, and to provide a resin sealing method which raises an operation availability in a production line. SOLUTION: A resin sealing apparatus includes: a lower mold set 1; a runner block 8 supported by the lower mold set 1; an upper mold set 2 which is connected to and separated from the lower mold set 1 and which forms a cavity 69 and a gate 62 in communication with the cavity 69; and a plunger plate 80 which reciprocates in a pot 66 formed between the upper mold set 2 and the runner block 8. In addition, at the plunger plate 80, melted resin in the pot 66 is filled in the cavity 69 from the gate 62. Then, after hardening the melted resin, the lower mold set 1 is separated from the upper mold set 2, and a resin molded item 93 in the cavity 69 and unnecessary resin 95 remaining in the pot 66 is decoupled. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009218415(A) 申请公布日期 2009.09.24
申请号 JP20080061166 申请日期 2008.03.11
申请人 DAIICHI SEIKO KK 发明人 OGATA KENJI;NISHIGUCHI MASASHI
分类号 H01L21/56 主分类号 H01L21/56
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