| 摘要 |
PROBLEM TO BE SOLVED: To provide a through-hole filled substrate whose through-hole has a high allowable current value, and to provide a method of manufacturing the same. SOLUTION: A through conductor 24 is composed of an intermediate layer 26 and an inner peripheral conductor 28 using two kinds of conductor pastes differing in baking shrinkage rate, so the intermediate layer 26 is firmly fixed to an inner peripheral surface of the through-hole 22 and the inner peripheral conductor 28 and then the through conductor 24 composed of them is firmly fixed in the through-hole 22. Further, the paste for the inner peripheral conductor has a small baking shrinkage rate and then size variation of the through conductor 24 during baking and in a temperature cycle is suppressed, so peeling of the through conductor 24 from the inner peripheral surface of the through-hole 22 and breaking of wiring between wiring layers 16 and 20 on upper and lower end surfaces thereof are suitably suppressed in combination with firm fixation of the intermediate layer 26 to the inner peripheral surface of the through-hole 22. COPYRIGHT: (C)2009,JPO&INPIT
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