| 摘要 |
PROBLEM TO BE SOLVED: To provide a grinding wheel capable of preventing scratches and a damaged deteriorated layer from being generated. SOLUTION: The grinding wheel 63 for grinding the back surface side of a wafer 5 includes: a ring base 64 having a roughly plane-shaped surface; a cushion layer 65 made of an elastic body and overlapping with the surface of the ring base 64; a sheet layer 66 made of metal sheet and overlapping with the surface of the cushion layer 65; and an abrasive grain layer 67 overlapped on the surface of the sheet layer 66 by electrodeposition or metal bonding and containing diamond abrasive grains 68 for grinding. COPYRIGHT: (C)2009,JPO&INPIT |
