| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device in which stress concentration on a bump and an electrode pad during flip-chip mounting is effectively reduced without making processes complicated, and to provide a method of manufacturing the same. <P>SOLUTION: The semiconductor device has an element electrode pad 3 for external connection disposed on a surface of a semiconductor element 2 and a substrate electrode pad 5 disposed on a surface of a wiring board 4, wherein the element electrode pad 3 and substrate electrode pad 5 opposed to each other are connected through the bump 6. The semiconductor device has first element electrode pads 3b and second substrate electrode pads 5b in thin and long shapes in which the widths of the pads 3b and 5b in a radial direction from the geometric center 21 of the semiconductor element 2 is smaller than the lengths in a direction orthogonal to the radial direction. <P>COPYRIGHT: (C)2009,JPO&INPIT |
