| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of an electronic component capable of preventing a part of an adhesive sheet from remaining attached to the electronic component after processing the electronic component, and preventing a part of the adhesive sheet from remaining attached to a support body. SOLUTION: This manufacturing method of the electronic component includes processes of: preparing the adhesive sheet with first and second adhesive layers different in a decomposition condition arranged thereon by interposing a film base material, sticking the first adhesive layer to the electronic component, and sticking the second adhesive layer to a support body to fix the electronic component to the support body; processing the electronic component in a state fixed to the support body; separating the electronic component from the support body by setting a state where the decomposition condition of the first adhesive layer stuck to the electronic component is satisfied, and the decomposition condition of the second adhesive layer stuck to the support body is not satisfied; and separating the adhesive sheet from the support body by setting a state where the decomposition condition of the second adhesive layer stuck to the support body is satisfied. COPYRIGHT: (C)2009,JPO&INPIT
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