| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting apparatus for immediately pressure-bonding a TCP(tape carrier package) on a substrate without temporarily pressure-bonding it. SOLUTION: The electronic component mounting apparatus is used for pressure-bonding an electronic component on a substrate using a thermosetting adhesive tape to be molten and cured by being heated. The mounting apparatus includes: a mounting head 14 in which a mounting tool 18 for sucking and holding the top surface of one end of a TCP3 allowing an adhesive tape 119 to be stuck on the bottom surface of the one end is provided so as to be driven in a vertical direction; a protective tape 101 having ventilation, provided on the mounting head, intervened between the mounting tool and the TCP when the mounting tool sucks and holds the top surface of one end of the TCP, and preventing a molten substance generated when the adhesive tape is heated and molten from adhering to the mounting tool; and a heater 18b which is provided on the mounting tool and heats and melts the adhesive tape via the protective tape when the TCP sucked and held by the mounting tool is mounted on the substrate. COPYRIGHT: (C)2009,JPO&INPIT
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