发明名称 DRY CLEANING METHOD AND SUBSTRATE TREATMENT EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide a dry cleaning method which does not adversely affect a substrate by heat, efficiently heats the substrate for dry-cleaning a surface of the substrate and does not cause a problem on an apparatus. SOLUTION: The dry cleaning method for mounting the substrate on a mounting base provided in a treatment chamber can vacuum extraction and dry-cleaning the surface of the substrate includes a step of introducing a cleaning gas into the treatment chamber and adsorbing the gas onto the substrate, and a step, after the adsorption of the cleaning gas onto the substrate, introducing an energy medium gas having thermal energy applied into the treatment chamber, supplying the thermal energy to the cleaning gas on the substrate from the energy medium gas and conducting cleaning reaction on the surface of the substrate. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009218276(A) 申请公布日期 2009.09.24
申请号 JP20080058028 申请日期 2008.03.07
申请人 TOKYO ELECTRON LTD 发明人 MIYOSHI SHUSUKE;GUNJI ISAO
分类号 H01L21/304;H01L21/302;H01L21/3065;H01L21/3205;H01L23/52 主分类号 H01L21/304
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