| 摘要 |
PROBLEM TO BE SOLVED: To provide a solder joint inspection device capable of inspecting a solder joint state between a semiconductor package and a printed wiring board difficult to inspect from the appearance thereof. SOLUTION: This solder joint inspection device 20 inspects a solder joint state of a printed wiring board assembly 10 provided with the printed wiring board 12, and the semiconductor package 14 stacked on and solder-jointed to the printed wiring board 12 through solder balls 16, and is provided with: a heating means 22 heating either the semiconductor package 14 or the printed wiring board 12; a measurement means 24 measuring a surface temperature distribution on the other side in a certain condition; and a determination means 26 determining quality of the solder joint state of the printed wiring board assembly 10 based on the surface temperature distribution measured by the measurement means 24 in the certain condition. COPYRIGHT: (C)2009,JPO&INPIT
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