WAFER-LIKE OPTICAL DEVICE, METHOD FOR MANUFACTURING WAFER-LIKE OPTICAL DEVICE, ELECTRONIC ELEMENT WAFER MODULE, SENSOR WAFER MODULE, ELECTRONIC ELEMENT MODULE, SENSOR MODULE AND ELECTRONIC INFORMATION APPARATUS

摘要

High optical accuracy is obtained by using a single material for optical component sections, such as a lens. The entire resin shrinkage generated during manufacture is suppressed by using a glass substrate (1) having a plurality of holes (11) as a base material (framework), and a wafer-state lens module (10) having a plurality of highly accurate resin lenses is formed. Furthermore, the thickness of a peripheral section (4) or (4A) can be accurately controlled by eliminating variance of a film thickness of the glass substrate (1) by means of a lens resin formed on the glass substrate (1), and lens variance can be accurately controlled for laminating a resin lens (2). The refractive index of the lens section of the resin lens (2) is kept uniform by forming the lens section by using only a single lens resin, designing is facilitated, the film thickness is accurately controlled and the highly accurate light collecting lens is manufactured.