| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide: a photosensitive composition can improve insulation reliability and plating resistance; a photosensitive film; a photosensitive laminate; a permanent pattern forming method; and a printed circuit board. <P>SOLUTION: The photosensitive composition includes a binder, a polymerizable compound, a heat crosslinking agent, a filler and a photopolymerization initiator, wherein a weight average of I/O value in a mixture of the binder, polymerizable compound and heat crosslinking agent is ≤0.70. <P>COPYRIGHT: (C)2009,JPO&INPIT |
