发明名称 METHOD AND APPARATUS FOR PROCESSING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To efficiently and surely replace a processing liquid by less consumption of a low surface tension solvent in substrate processing method and apparatus for replacing a liquid for processing the surface of the substrate by a low surface tension solvent such as IPA. SOLUTION: After the end of rinse processing, the rotational speed of a substrate W is reduced from 600 rpm to 10 rpm and a DIW liquid film is formed like a paddle (paddle formation processing). Then, IPA is supplied while moving a solvent discharge nozzle 765 from the center of the substrate W to a peripheral edge in a direction Dn to add the IPA to the DIW liquid film on the substrate W and to reduce surface tension (solve supply processing). After the solvent discharge nozzle 765 reaches the peripheral edge of the substrate W and the solvent supply processing ends, an interception member 9 having a solvent supply route 97 on the center is arranged in close to the substrate W and the rotation speed of the substrate W is increased while supplying the IPA to a solvent supply port 97a to expand a replacement area SR by the IPA to the whole substrate (replacement processing). COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009218456(A) 申请公布日期 2009.09.24
申请号 JP20080062065 申请日期 2008.03.12
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 NAKAMURA KAZUKI
分类号 H01L21/304 主分类号 H01L21/304
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