发明名称 INSULATING FILM FORMING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a method of forming an insulating film capable of reducing a buildup portion of a dry-film resist at a low cost without using any press equipment. SOLUTION: By installing a thick PET film 5 of 220μm or more on a dry-film resist 4 at the time of a vacuum lamination, a buildup portion of the dry-film resist 4 can be reduced only by a usual vacuum laminating apparatus without adding any press process after the vacuum lamination. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009218305(A) 申请公布日期 2009.09.24
申请号 JP20080058900 申请日期 2008.03.10
申请人 FUJI ELECTRIC DEVICE TECHNOLOGY CO LTD 发明人 HIROSE TAKAYUKI;EDO MASAHARU
分类号 H01L21/56;H05K3/28 主分类号 H01L21/56
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