Arrangement for flip-chip-dry construction, has integrated switching circuit with multiple solder contact elements and support, on which integrated switching circuit is positioned

摘要

The arrangement has an integrated switching circuit with multiple solder contact elements and a support (100), on which the integrated switching circuit is positioned. The support has multiple contact points on its side that faces the integrated circuit. The contact point is aligned to an electro conductive connection with solder contact elements of the integrated switching circuit by a fusion soldering process. Independent claims are included for the following: (1) a testing arrangement for testing the position of an integrated circuit relative to a carrier of an arrangement in flip-chip-dry construction; and (2) a method for testing the position of an integrated circuit relative to a carrier of an arrangement in flip-chip-dry construction.