| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing method and a manufacturing method of a semiconductor device which are suitable for handling a small number of substrates and reduce a cost. SOLUTION: A small batch-type CVD device 1 is constituted so that the number of product wafers Wb to be processed at once is set less than or equal to the number of the substrates to be stored in one product wafer pod 26B, and the product wafer Wb stored in one product wafer pod 26B is put in a boat 9 together with a side dummy wafer Wa stored in a side dummy wafer pod 26A and is processed at a same time by a process tube. Since the number of product wafers which are subjected to batch processing collectively are stored in one pod, it is possible to eliminate the need to use a shelf for temporarily storing a pod, a pod transferring apparatus for transferring the pod between the shelf and a pod stage or the like, thus reducing an initial cost and a running cost of a batch-type CVD device. COPYRIGHT: (C)2009,JPO&INPIT
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